NovoLINC

NovoLINC was co-founded by Dr. Ning Li, Prof. Sheng Shen, and Dr. Rui Cheng. The team recognized early on that the ever-increasing performance and power requirements of electronic chipsets were leading to enormous heat generation. Advancements in thermal interface solutions had not kept pace, making thermal management a critical bottleneck in efficient cooling and effective heat dissipation, especially as AI datacenters transition to liquid cooling. To address this issue, NovoLINC's CTO Dr. Rui Cheng developed a breakthrough nanostructured composite thermal interface material at Carnegie Mellon University that significantly advances thermal performance beyond traditional materials. Their solution reduces thermal resistance to an industry-record low (<1 mm²·K/W), offering outstanding thermal performance and reliability for cooling high-power electronics such as CPUs and GPUs. With its unique design, it enables sustainable scaling of semiconductor and data center industries. 

The company's investors include M Ventures, Foothill Ventures, and TDK Ventures.