FMC has developed the most advanced ferroelectric hafnium oxide memory technology to deliver leading-edge non-volatile memory for future electronics and computing innovation. The company emerged from stealth mode in July 2018 and is currently working with major semiconductor companies for its embedded and stand-alone memory solution. Its ferroelectric field-effect transistor (FeFET) and capacitor (FeCAP) technology is simple to integrate, fast, low-power, and scalable, and has high endurance with decades of data retention, suitable for a broad range of AI, IoT, edge, data center, and embedded applications.
Strong investor syndicate will enable FMC to accelerate commercialization of its disruptive non-volatile ferroelectric memory technology for a broad set of memory and compute applications
